with each new generation semiconductor devices become more complex. Due to this, the requirements regarding process reliability and early recognition of process deviations are rising. For fast and precise identification of such deviations you should use failure analysis laboratories.

Rood Technology has extended its failure analysis capabilities both personnel and technically.

Our new Scanning Acoustic Microscope with "through transmission mode" enables us to analyse quicker with clearly enlarged scan area and higher resolution. Besides this we have a lot of further investigation methods and capabilities like:

• Material Analysis using EDX
• Scanning Electron Microscopy (SEM)
• Backside Polishing, Infrared Microscopy
• X-ray Investigation
• Electrical Characterisation, ATE tests
• Bond Pull / Die Shear test
• Plasma Etching
• Cross Sectioning
• Long-term temperature Cycling

In close co-operation with the qualification and test departments at Rood Technology also continuative solutions can be offered. For technical questions or for the solutions of your projects and requirements our failure analysis team is pleased to support you.

Your ROOD Technology Failure Analysis - Team

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