• diagnosis methods
• process tool evaluation
• ESDFOS prevention

In future ESD protection directly in the production flow and of equipment used is of prime importance. During Productronica 2007 this brand-new service offered by Rood Technology has been presented to the public. On-site ESD-Audits in the wafer fab or fabrication process are carried out by Rood Technology in cooperation with the EMPA in Switzerland.

As a pickup event a presentation has been held within the ZVEI forum during Productronica to sensitize for this important technical aspect in order to ensure quality and to increase yield during the manufacturing process.

Abstract of the presentation
New challenges for ESD Reviewing in Assembly & Robotic Production

Modern integrated circuits, MEMS and MOEMS are manufactured in large volume production and continuously decrease in dimensions towards nanoscaling. Protection against ESD thus becomes to utmost importance, however, it is still mostly understood in the classical schemes of ESD protected workplaces, antistatic clothing and device pin protection circuitry. However, another problem, which we call ESDFOS (Electrostatic Discharge From Outside to Surface) is more and more increasing and still remains often unrecognized: Robotic movements in modern device assembly processing machines cause charging of automated handlers, slide rails etc. and thus charge or discharge devices-in-process through their surfaces and passivations/ protective surface layers.

ESD protection circuits and diodes, which are quite usual for device pin protection, remain useless against such surface micro sparks. ESDFOS acts directly or very close to the impact location, similar like thunderstorm lightnings. Unfortunately, the resulting damages look very similar to mechanically caused damage types. The lecture presents an overview of failure mechanisms, diagnosis methods and how process tool evaluation and ESDFOS prevention can be handled.

Download the presentation (3.251 KB)