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Failure / Technological Analysis
An analysis of the defective devices (Failure Analysis) is carried out by experienced
engineers supported by modern equipment using relevant physical, metallurgical and
chemical analytical techniques. This is used to verify detected failures, to identify the
mechanism and to initiate corrective actions for quick turn quality improvement.
Destructive Physical Analysis (DPA) / Construction Analysis
Rood Technology's extensively equipped laboratory is capable of providing DPA.
Construction Analysis can be performed as part of reliability assessment. The objective
of the Construction Analysis is the early identification of potential deficiencies which can
cause zero hour failures or reliability problems.
The equipment ranges from SEM, SAM, EMI to X-ray and standard laboratory equipment
up to wafer probers and ATE for electrical test. All analysis findings and results are
brought together in a comprehensive report.