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You are here: Home » Test & Service Division » Electrical Testing » Test of Packaged Parts
 
   

 Test of Packaged Parts

 
   
Although semiconductor manufacturing yields are always improving there is still the
requirement for electrical test service. This test service is offered to all companies to
provide them with more flexibility in covering their additional capacity demands or to
solve their specific selection needs.

Driven by the market Rood Technology“s test lab operation performs the electrical
tests for families such as Analog, Digital, Memories, Mixed Signal, ASICs, ASSPs,
SOCs, Embedded, RF products and Sensors.

The tests can be performed for low and high volume whilst maintaining the highest
quality standards.

Testing of products in various package styles e.g. BGA,. QFP, TSOP, SO, SOJ, PLCC,
DIL, SOT, TO is performed at temperatures between -55°C to +155°C.

A variety of fully automated handling equipment is installed. Automatic test equipment
from Advantest, Ando, Credence, LTX, Schlumberger, SZ and Teradyne is used.

In order to achieve competitive prices, a high throughput by using parallel test is an
absolute must. The availability of more than one single test cell enables us to handle
high volumes.

 

 

   
 




Rood Testhouse International N.V. - Oettinger Str. 6 - 86720 Noerdlingen - Germany
Phone: +49 (0) 9081 - 804 - 0    Fax: +49 (0) 9081 - 804 -208
E-Mail: info@roodtechnology.com
 

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