Wafer level testing gives confidence to the manufacturers that dice placed in their
products are functioning correctly.Production probing is carried out under class 1000 clean room conditions.
Analog, Digital and Mixed Signal wafers from 4”, 6” up to 8” diameter are fully auto-
mated probed with equipment from Electroglas and KLA at a temperature
range from +5°C up to 150°C.
Test and / or quality data like good die or rejects can be reported in a wafer map.
For sure ink makring can be offered when it is requested by the assembler.
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